ASI Compound 70

MULTI-PURPOSE SILICONE GREASE

AUTOMOTIVE,MARINE, FOOD ZONE APPLICATIONS, INSULATES ELECTRONIC COMPONENTS

ASI Compound 70 Multi-Purpose Silicone Grease is a moisture resistant, non-curing paste which retains its consistency and properties over a temperature range of -70°F to 400°F.

This stiff, tacky compound is non-melting and retains its properties over extended periods of use. ASI Compound 70 has excellent dielectric properties and is highly water repellant and resistant to oxidation. ASI Compound 70 can be used as a release agent, lubricant, dielectric grease, water repellant, corrosion protectant and applications where resistance to thermal degradation or electrical insulation are needed. ASI Compound 70 is also NSF H1 registered for use around food processing areas.

Compound-70-Silicone-Grease

Features

Resists Water Washout & Spray
Excellent Long-Term Water Resistance
Retains Consistency From -70°F to 400°F
Compatible With Rubbers & Plastics
Resistant To A Variety Of Chemicals
Protects Against Oxidation & Corrosion
Resistant To Thermal Degradation
Excellent Dielectic Properties
Insulates & Protects Electronic Components
Excellent Lubricant With Water Resistance
Remains A Thick Paste, Easy To Use

Physical properties

Physical Properties	Test Method	Result
NLGI Grade	DIN 51818	2
Specific Gravity	ASI Test Method	0.99
Water Spray Off	ASTM D4049	4%
Evaporation, 24 Hrs, 200°C	ASI Test Method	<1%
Bleed, 24 Hrs, 200°C	ASI Test Method	<2%
Penetration Unworked	ASTM D217	270
Penetration Worked (60x)	ASTM D217	285
Dielectic Strength, 0.01 Gap	ASTM D149	>700 (Volts/Mil)
Volume Resistivity	ASTM D257	1.8x1014
Dielectic Constant 1000 Hz	ASTM D150	3.0
Dissipation Factor, 1000 Hz	ASTM D150	.0016
Arc Resistance, RT	ASTM D495	120 (Sec)

Information on this data sheet can change without notice and it is therefore not recommended that these figures be used in spec writing. If you have any questions contact manufacturer‘s sales and technical service department.

Conforms / Meets / Exceeds

SAE-AS-8660
FDA-CFR-21-178.3570
NSF Category Code: H1 (Nonfood Compounds Program
Listed Registration No. 151561)

Common Substrates

For a complete list of applications & substrates or more product information, please contact us.

Common Applications

0EM Applications
Dielectric Grease
Release Agent for Plastic Extrudes
Corrosion Protection (Battery Terminals, Copper Conductors & Device Leads)
General Industrial Applications
Disconnect Junctions In Electrical Wiring Systems
Lubricant (Bearings, Bushings, Gears & Chains)

Can be used for various applications depending upon substrate

Speak with a sales engineer to discuss ASI Compound 70 or any of our other products or manufacturing services! Use our contact form or call 800-325-7040 now.