ASI Compound 70

MULTI-PURPOSE SILICONE GREASE

AUTOMOTIVE,MARINE, FOOD ZONE APPLICATIONS, INSULATES ELECTRONIC COMPONENTS

ASI Compound 70 Multi-Purpose Silicone Grease is a moisture resistant, non-curing paste which retains its consistency and properties over a temperature range of -70°F to 400°F.

This stiff, tacky compound is non-melting and retains its properties over extended periods of use. ASI Compound 70 has excellent dielectric properties and is highly water repellant and resistant to oxidation. ASI Compound 70 can be used as a release agent, lubricant, dielectric grease, water repellant, corrosion protectant and applications where resistance to thermal degradation or electrical insulation are needed. ASI Compound 70 is also NSF H1 registered for use around food processing areas.

Features

  • Resists Water Washout & Spray
  • Excellent Long-Term Water Resistance
  • Retains Consistency From -70°F to 400°F
  • Compatible With Rubbers & Plastics
  • Resistant To A Variety Of Chemicals
  • Protects Against Oxidation & Corrosion
  • Resistant To Thermal Degradation
  • Excellent Dielectic Properties
  • Insulates & Protects Electronic Components
  • Excellent Lubricant With Water Resistance
  • Remains A Thick Paste, Easy To Use

Physical properties

Physical PropertiesTest MethodResult
NLGI GradeDIN 518182
Specific GravityASI Test Method0.99
Water Spray OffASTM D40494%
Evaporation, 24 Hrs, 200°CASI Test Method<1%
Bleed, 24 Hrs, 200°CASI Test Method<2%
Penetration UnworkedASTM D217270
Penetration Worked (60x)ASTM D217285
Dielectic Strength, 0.01 GapASTM D149>700 (Volts/Mil)
Volume ResistivityASTM D2571.8x1014
Dielectic Constant 1000 HzASTM D1503.0
Dissipation Factor, 1000 HzASTM D150.0016
Arc Resistance, RTASTM D495120 (Sec)

Information on this data sheet can change without notice and it is therefore not recommended that these figures be used in spec writing. If you have any questions contact manufacturer‘s sales and technical service department.

Conforms / Meets / Exceeds

  • SAE-AS-8660
  • FDA-CFR-21-178.3570
  • NSF Category Code: H1 (Nonfood Compounds Program
    Listed Registration No. 151561)

Common Substrates

For a complete list of applications & substrates or more product information, please contact us.

Common Applications

  • 0EM Applications
  • Dielectric Grease
  • Release Agent for Plastic Extrudes
  • Corrosion Protection (Battery Terminals, Copper Conductors & Device Leads)
  • General Industrial Applications
  • Disconnect Junctions In Electrical Wiring Systems
  • Lubricant (Bearings, Bushings, Gears & Chains)

Can be used for various applications depending upon substrate

Speak with a sales engineer to discuss ASI Compound 70 or any of our other products or manufacturing services! Use our contact form or call 800-325-7040 now.